2.54 Mm Zig-zag Soldermask Size 3 Busboard 38 x 62 Holes Busses BB3U
Also Known As:
2.54mm Zig-zag Busboard, Soldermask Busboard, 38 x 62 Holes, BB3U Busboard, Size 3 Busboard, Soldermask Protected, 2.54mm Pitch & Electronics Breadboard.
About:
• This product appears to be a bus board (a type of prototyping platform) with specific measurements, hole arrangements, and features that make it a versatile tool for developing and testing electronic circuits.
• The BusBoard-3U prototyping circuit board has the BusBoard zig-zag circuit pattern. It is useful for connecting headers and DIP ICs pin-to-pin without cutting tracks or adding wires. It’s great for 2-row parts with many common signals such as memory buses or power and ground connections for ICs. Opposite sides of the IC or connector are on separate tracks to simplify wiring. Wide and narrow tracks and locator holes identify which pads are connected. The solder mask helps avoid shorts when soldering. The PCB accepts a 96-pin DIN-41612 VME connector for backplane or board-to-board applications. Holes for ejector latches are provided.
Common Applications:
• Flexibility: The zig-zag pattern and the number of holes provide flexibility for mounting a variety of components.
• Durability: The solder mask offers protection to the underlying circuits and improves the durability of soldered components.
• Ease of Use: The bus board’s layout makes it user-friendly, allowing for easy assembly and modifications.
• Electronic prototyping and testing
• Educational purposes, for teaching circuit design and electronics
• Hobbyist projects for DIY electronics enthusiasts
Construction:
• Material: The base could be made of a durable, non-conductive material like FR4 fiberglass, providing stability and heat resistance.
• Hole Layout: A 38 x 62 grid, with a 2.54mm zig-zag pattern, optimized for versatility and compatibility with a wide range of components.
• Bus Configuration: The BB3U might refer to a unique bus layout that enhances the board’s functionality, making it easier to distribute power and signals.
• Protective Coating: A solder mask for protecting the underlying circuit traces and pads, offering enhanced durability and ease of soldering.
Features:
• Reduces cut traces and jumper wires to speed prototype assembly.
• The zig-zag pattern can be used to connect DIP ICs and DIL headers pin-to-pin.
• Etched high-quality FR4 glass-epoxy circuit board with solder mask to prevent solder bridges.
• Single-sided, 1oz/ft2 copper, anti-tarnish coating for easy soldering.
• 38 x 62 holes, 76 separate BusBoard traces, 0.037″ holes are drilled on 0.1″ (2.54mm) centers.
• Standard single height (3U) Eurocard/VME size: 3.9″ wide, 6.3″ long, 1/16″ thick (100 x 160 x 1.6mm).
Specification:
• Etched FR4 glass-epoxy circuit board.
• Solder mask to prevent solder bridges.
• Single-sided, 1oz/ft2 copper, anti-tarnish coating for easy soldering. Lead-free and RoHS compatible.
• Holes are drilled on 0.1″ (2.54mm) centers.
• 0.037″ (0.94mm) holes sized for ICs or square post headers.
• 38 x 62 holes, 76 separate BusBoard traces.
• Size 3U = 3.9″ wide, 6.3″ long, 1/16″ thick (100 x 160 x 1.6mm).
